Assembling in clean room. Each optical, mechanical and electronic subsystem is carefully cleaned and sanitised, before being incorporated in a LaserWriter unit. Each unit is assembled and tested in clean-room, in order to minimise the possibility of particle release in the future operating environment.

CIF, DXF, GDSII data formats. The LaserWriter operation is managed by a proprietary PhotonSteer software package. For pattern description, standard languages like CIF, DXF,GDSII and others can be used.

Course on microlithography. For all systems, a specialised course on standard and laser microlithography is provided. The course is held directly at the customer's site, just after system installation and test.

Energy stabiliser. The exposure level is monitored and kepk constant during the writing process.

Exposure. The standard wavelength of the writing beam is 405 nm (from a GaN solid state laser), suited for any G- or H-line resist. A 375 nm laser source can be added, specific for SU8 and other UV-sensitive resists. Another additional laser source can be included, for surface microablation or other processing. Variable pixel to pixel exposure is also available (grey-level patterning) for the fabrication of diffractive optics, MEMs, etc..

Floor vibration isolation. The system is supplied ready for installation on the floor. A vibration isolation leg frame is included.

Laser beam focusing. The LaserWriter includes a full automatic autofocus and surface-track system, capable to dinamically keep the laser beam focused on the substrate even if this is slightly concave, convex or tilted.

Max working area. A wide range of patterning areas can be selected, from 2"x2" to 13" to 13". A vacuum chuck is used, whose surface can be configured according to customer specifications).

Minimum linewidth. Each system includes a complete set of laser focusing lenses, allowing the operator to select the minimum linewidth among 0.7, 1.6, 4 and 8 µm. Optionally a very low resolution mode can be used (15 µm) for patterning high density interconnects or microwave circuits.

Writing on non-planar substrates. This option allows microlithographic operations to be performed on samples with poor planarity or slightly concave or convex substrate.

Positioning accuracy. This parameter indicates the absolute positioning error on the whole working area, and has a fundamental role in the possibility of overlapping the features belonging to different masking or process levels. Note that it has no relation with the achievable resolution - i.e. the minimum linewidth. The high accuracy of the standard LaserWriter comes directly from a real time laser interferometric control of beam position during the writing process. For less demanding applications, the interferometer can be replaced by linear optical encoders.

Safety. Both emergency stop buttons and safety interlocks are provided. All system components fulfill safety international regulations and are CE marked for safe operation and electromagnetic compatibility.

Selectable full manual control. A full manual control mode is available for all models. This mode is useful when the system is used as an inspection and metrology station.

Substrate inspection. Each system includes a high-resolution CMOS camera and related illumination system. This allows the operator to use the LaserWriter as a surface inspection and metrology system.

Training for operators. A specific training for the personnel responsible of LaserWriter operation is provided, under direct supervision of MICROTECH technicians.

Variable resolution. Some processes can take advantage of a reduced planar resolution during a microlithographic step. One typical example is the use of rough surfaces as a substrate (alumina, for instance). In the LaserWriter system the resolution is changed by replacing the beam focusing optics, which takes only a few seconds.

Write modes. A variety or wite modes is available: beam-scan, scatter-scan, stage-scan, vector, contour, flash.

Writing on tilted substrates. Patterning can be made also on slightly tilted samples (up to 2°). This is useful in a R&D environment, if small samples are used after being glued to a larger holder. Although the samples are still planar, the uneven glue layer can affect their orthogonality with the laser beam. In such case the operator can easily instruct the machine to follow the substrate plane during the writing process.